Wang, TengTengWangBex, PieterPieterBexCapuz, GiovanniGiovanniCapuzDuval, FabriceFabriceDuvalInoue, FumihiroFumihiroInoueGerets, CarineCarineGeretsBertheau, JulienJulienBertheauRebibis, Kenneth JuneKenneth JuneRebibisMiller, AndyAndyMillerBeyer, GeraldGeraldBeyerBeyne, EricEricBeyneNatsukawa, MasanoriMasanoriNatsukawaMitsukura, KazuyukiKazuyukiMitsukuraHatakeyama, KeiichiKeiichiHatakeyama2021-10-232021-10-232016https://imec-publications.be/handle/20.500.12860/275743D IC assembly using thermal compression bonding and wafer-level underfill – strategies for quality improvement and throughput enhancementProceedings paperhttp://ieeexplore.ieee.org/document/7861589/