Brongersma, SywertSywertBrongersmaRichard, EmmanuelEmmanuelRichardVervoort, IwanIwanVervoortMaex, KarenKarenMaex2021-10-142021-10-142000https://imec-publications.be/handle/20.500.12860/4157A grain size limitation inherent to electroplated copper filmsProceedings paper