Relationships between deposition parameters, step coverage, throughput, and electrical properties of PEALD SiO2 insulation liners for HVM TSV application

Jung, In SooIn SooJungWoo, Jeong-JunJeong-JunWooKwon, Hak YongHak YongKwonKim, Young-JaeYoung-JaeKimKang, Dong-SukDong-SukKangPark, Ju-HyukJu-HyukParkAhn, Dae-YoungDae-YoungAhnChoi, Seung-WooSeung-WooChoiPark, Hyung-SangHyung-SangParkYoo, Yong MinYong MinYooCivale, YannYannCivaleRedolfi, AugustoAugustoRedolfiThangaraju, SarasvathiSarasvathiThangarajuTravaly, YoussefYoussefTravalySwinnen, BartBartSwinnenBeyne, EricEricBeyneDe Roest, DavidDavidDe RoestBeynet, JulienJulienBeynet2021-10-192021-10-192011https://imec-publications.be/handle/20.500.12860/19144Relationships between deposition parameters, step coverage, throughput, and electrical properties of PEALD SiO2 insulation liners for HVM TSV applicationMeeting abstract