Duval, FabriceFabriceDuvalWang, TengTengWangCapuz, GiovanniGiovanniCapuzGerets, CarineCarineGeretsMiller, AndyAndyMillerRebibis, Kenneth JuneKenneth JuneRebibisBeyne, EricEricBeyne2021-10-222021-10-222015https://imec-publications.be/handle/20.500.12860/25238Comparison of electrical properties of thermo-compression bonded 3D stacks using a liquid and a dry-film wafer level underfillsMeeting abstract