Global interconnect trade-off for technology over memory modules to application level: case study

Papanikolaou, AntonisAntonisPapanikolaouMiranda, MiguelMiguelMirandaCatthoor, FranckyFranckyCatthoorCorporaal, HenkHenkCorporaalDe Man, HugoHugoDe ManDe Roest, D.D.De RoestStucchi, M.M.StucchiMaex, KarenKarenMaex2021-10-152021-10-152003https://imec-publications.be/handle/20.500.12860/7972Global interconnect trade-off for technology over memory modules to application level: case studyProceedings paper