A novel iso-thermal intermetallic compound insertion bonding approach to improve throughput for 3D die to wafer stacking

Hou, LinLinHouDerakhshandeh, JaberJaberDerakhshandehCapuz, GiovanniGiovanniCapuzLofrano, MelinaMelinaLofranoBeyne, EricEricBeyneMiller, AndyAndyMillerBeyer, GeraldGeraldBeyerDe Wolf, IngridIngridDe Wolf2023-06-202023-06-2020200569-5503WOS:000620983200216https://imec-publications.be/handle/20.500.12860/42028A novel iso-thermal intermetallic compound insertion bonding approach to improve throughput for 3D die to wafer stackingProceedings paper10.1109/ECTC32862.2020.00228978-1-7281-6180-8WOS:000620983200216