Croes, KristofKristofCroesLofrano, MelinaMelinaLofranoWilson, ChrisChrisWilsonCarbonell, LaureLaureCarbonellSiew, Yong KongYong KongSiewBeyer, GeraldGeraldBeyerTokei, ZsoltZsoltTokei2021-10-192021-10-192011https://imec-publications.be/handle/20.500.12860/18752Study of void formation kinetics in cu interconnects using local sense structuresProceedings paper