Carchon, GeertGeertCarchonCarbonell, LaureLaureCarbonellJenei, SnezanaSnezanaJeneiVan Hove, MarleenMarleenVan HoveDecoutere, StefaanStefaanDecoutereDe Raedt, WalterWalterDe RaedtMaex, KarenKarenMaexBeyne, EricEricBeyne2021-10-152021-10-152003https://imec-publications.be/handle/20.500.12860/7278Wafer-level packaging technology for extended global wiring and inductorsProceedings paper