Browsing by imec author "2c2984af95289fc48256ae9db3e08325d693fbee"
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Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding and TSVs
Naeim, Mohamed; Yang, Hanqi; Chen, Pinhong; Bao, Rong; Dekeyser, Antoine; Sisto, Giuliano; Brunion, Moritz; Chen, Rongmei; Van der Plas, Geert; Beyne, Eric; Milojevic, Dragomir (2023)