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Publication Development and Characterization of Electrodeposited Tin-Indium Alloy Microbumps for Low Temperature Assembly
Proceedings paper2025, IEEE 75th Electronic Components and Technology Conference (ECTC), 2025-05-27, p.1924-1928Publication Thermal-Mechanical behavior of highly (111)-oriented Nano Twinned Electroplated copper for advanced electronic packaging
Proceedings paper2025, 75th Electronic Components and Technology Conference (ECTC), 2025-05-27, p.958-964Publication Conformance Test Cases for the RDF Mapping Language (RML)
Proceedings paper2019, Knowledge Graphs and Semantic Web (KGSWC 2019), 2019-06-23, p.162-173Publication Device-Free Visible Light Sensing: A Survey
Journal article2026, IEEE COMMUNICATIONS SURVEYS AND TUTORIALS, 28, p.3791-3829