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Publication Incorporation of Temperature Impact on Hot-Carrier Degradation into Compact Physics Model
Journal article2025, MICROMACHINES, (16) 12, p.1424Publication End-to-End Evaluation of the Int5Gent Platform: Integrating 5G Enabling Technologies in a Holistic Service to Physical Layer Platform
Proceedings paper2025, Joint European Conference on Networks and Communications & 6G Summit (EuCNC/6G Summit), 2025-05-03, p.823-828Publication Ultimate Layer Stacking Technology for High Density Sequential 3D Integration
Proceedings paper2023, International Electron Devices Meeting (IEDM), 2023-12-09Publication Pulse-Based Capacitive Memory Window with High Non-Destructive Read Endurance in Fully BEOL Compatible Ferroelectric Capacitors
Proceedings paper2023, International Electron Devices Meeting (IEDM), 2023-12-09