Browsing by author "Zhang, Boyao"
Now showing items 1-2 of 2
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New Cu "Bulge-Out" Mechanism Supporting Sub Micron Scaling of Hybrid Wafer-to- Wafer Bonding
De Messemaeker, Joke; Witters, Liesbeth; Zhang, Boyao; Tsau, Thomas; Fodor, Ferenc; De Vos, Joeri; Beyer, Gerald; Croes, Kristof; Beyne, Eric (2023) -
Simulation of Cu pad expansion in wafer-to-wafer Cu/SiCN hybrid bonding
Tsau, Yan Wen; De Messemaeker, Joke; Salahouelhadj, Abdellah; Gonzalez, Mario; Witters, Liesbeth; Zhang, Boyao; Seefeldt, Marc; Beyne, Eric; De Wolf, Ingrid (2022)