Now showing items 1-3 of 3

    • Large area interposer lithography 

      Flack, Warren; Hsieh, Robert; Kenyon, Gareth; Ranjan, Manish; Slabbekoorn, John; Miller, Andy; Beyne, Eric; Toukhy, Medhat; Lu, PingHung; Yi, Cao; Chen, Chunwei (2014)
    • Microbump lithography for 3D stacking applications 

      Jaenen, Patrick; Slabbekoorn, John; Miller, Andy; Flack, Warren W.; Ranjan, Manish; Kenyon, Gareth; Hsieh, Robert; Nguyen, Ha-Ai (2013)
    • Process characterization for donut TSV's 

      Slabbekoorn, John; Schepers, Bart; Sardo, Stefano; Van Huylenbroeck, Stefaan; Vandeweyer, Tom; Miller, Andy; Rebibis, Kenneth June; Flack, Warren; Kenyon, Gareth; Hsieh, Robert; Ranjan, Manish (2014)