dc.contributor.author | Limaye, Paresh | |
dc.contributor.author | Vandevelde, Bart | |
dc.contributor.author | Labie, Riet | |
dc.contributor.author | Vandepitte, Dirk | |
dc.contributor.author | Verlinden, Bert | |
dc.date.accessioned | 2021-10-17T08:24:53Z | |
dc.date.available | 2021-10-17T08:24:53Z | |
dc.date.issued | 2008 | |
dc.identifier.issn | 1521-3323 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/14041 | |
dc.source | IIOimport | |
dc.title | Influence of intermetallic properties of lead-free flip chip solder joints | |
dc.type | Journal article | |
dc.contributor.imecauthor | Vandevelde, Bart | |
dc.contributor.imecauthor | Labie, Riet | |
dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
dc.contributor.orcidimec | Labie, Riet::0000-0002-1401-1291 | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 51 | |
dc.source.endpage | 57 | |
dc.source.journal | IEEE Transactions on Advanced Packaging | |
dc.source.issue | 1 | |
dc.source.volume | 31 | |
imec.availability | Published - open access | |