Browsing Book chapters by imec author "28b9901c5d32a1480fa8005ff937aaa75595825f"
Now showing items 1-3 of 3
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Cost considerations for three-dimensional integration
Velenis, Dimitrios (2017) -
TSV characterization and modeling
Stucchi, Michele; Katti, Guruprasad; Velenis, Dimitrios (2011) -
Ultra-fine pitch 3D-stacked integrated circuits: technology, design enablement and application
Milojevic, Dragomir; Agrawal, Prashant; Raghavan, Praveen; Van der Plas, Geert; Catthoor, Francky; Van der Perre, Liesbet; Velenis, Dimitrios; Varadarajan, Ravi; Beyne, Eric (2019)