Browsing Book chapters by imec author "7813dc6305c66871af37da599e312fe3c5d82b18"
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Cu to Cu interconnect using 3D-TSV and wafer to wafer thermo-compression bonding
Soussan, Philippe; Huyghebaert, Cedric; Phommahaxay, Alain (2010-12) -
Thinning, via reveal and backside processing - overview
Beyne, Eric; Jourdain, Anne; Phommahaxay, Alain (2014)