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Guest Editors' Introduction: Special Issue on Design and Test of Multidie Packages

dc.contributor.authorCron, Adam
dc.contributor.authorJiao, Hailong
dc.contributor.authorMarinissen, Erik Jan
dc.date.accessioned2022-12-22T15:43:19Z
dc.date.available2022-09-16T02:49:57Z
dc.date.available2022-12-22T15:43:19Z
dc.date.issued2022
dc.identifier.issn2168-2356
dc.identifier.otherWOS:000850868500005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/40433.2
dc.sourceWOS
dc.titleGuest Editors' Introduction: Special Issue on Design and Test of Multidie Packages
dc.typeEditorial material
dc.contributor.imecauthorMarinissen, Erik Jan
dc.contributor.orcidimecMarinissen, Erik Jan::0000-0002-5058-8303
dc.identifier.doi10.1109/MDAT.2022.3192358
dc.source.numberofpages2
dc.source.peerreviewno
dc.source.beginpage5
dc.source.endpage6
dc.source.journalIEEE DESIGN & TEST
dc.source.issue5
dc.source.volume39
imec.availabilityPublished - imec


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220.500.12860/40433.2*2022-12-22T15:41:54Zvalidation by library/open access desk
120.500.12860/404332022-09-16T02:49:57Z

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