dc.contributor.author | Sankatali, Venkateswarlu | |
dc.contributor.author | Mishra, Subrat | |
dc.contributor.author | Oprins, Herman | |
dc.contributor.author | Vermeersch, Bjorn | |
dc.contributor.author | Brunion, Moritz | |
dc.contributor.author | Han, Jun-Han | |
dc.contributor.author | Stan, Mircea R. | |
dc.contributor.author | Biswas, Dwaipayan | |
dc.contributor.author | Weckx, Pieter | |
dc.contributor.author | Catthoor, Francky | |
dc.date.accessioned | 2023-11-28T12:50:54Z | |
dc.date.available | 2023-10-24T17:34:30Z | |
dc.date.available | 2023-11-28T12:50:54Z | |
dc.date.issued | 2023 | |
dc.identifier.issn | 1063-8210 | |
dc.identifier.other | WOS:001079165100001 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/42939.2 | |
dc.source | WOS | |
dc.title | Impact of 3-D Integration on Thermal Performance of RISC-V MemPool Multicore SOC | |
dc.type | Journal article | |
dc.contributor.imecauthor | Mishra, Subrat | |
dc.contributor.imecauthor | Oprins, Herman | |
dc.contributor.imecauthor | Vermeersch, Bjorn | |
dc.contributor.imecauthor | Brunion, Moritz | |
dc.contributor.imecauthor | Biswas, Dwaipayan | |
dc.contributor.imecauthor | Weckx, Pieter | |
dc.contributor.imecauthor | Catthoor, Francky | |
dc.contributor.imecauthor | Sankatali, Venkateswarlu | |
dc.contributor.orcidimec | Oprins, Herman::0000-0003-0680-4969 | |
dc.contributor.orcidimec | Vermeersch, Bjorn::0000-0001-8640-672X | |
dc.contributor.orcidimec | Brunion, Moritz::0000-0001-7842-7774 | |
dc.contributor.orcidimec | Catthoor, Francky::0000-0002-3599-8515 | |
dc.contributor.orcidimec | Sankatali, Venkateswarlu::0000-0002-1616-6764 | |
dc.identifier.doi | 10.1109/TVLSI.2023.3314135 | |
dc.source.numberofpages | 9 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 1896 | |
dc.source.endpage | 1904 | |
dc.source.journal | IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS | |
dc.source.issue | 12 | |
dc.source.volume | 31 | |
imec.availability | Published - imec | |
dc.description.wosFundingText | The work of Jun-Han Han and Mircea R. Stan was supported in part by the Semiconductor Research Corporation (SRC) Joint University Microelectronics Program (JUMP) Task 2780.003: Thermal and Power Management. | |