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dc.contributor.authorBosman, Dries
dc.contributor.authorHuynen, Martijn
dc.contributor.authorDe Zutter, Daniel
dc.contributor.authorSun, Xiao
dc.contributor.authorPantano, Nicolas
dc.contributor.authorvan der Plas, Geert
dc.contributor.authorBeyne, Eric
dc.contributor.authorGinste, Dries Vande
dc.contributor.authorVande Ginste, Dries
dc.date.accessioned2024-03-04T13:34:04Z
dc.date.available2023-12-02T16:54:11Z
dc.date.available2024-03-04T13:34:04Z
dc.date.issued2023
dc.identifier.issn2156-3950
dc.identifier.otherWOS:001098139000005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/43210.2
dc.sourceWOS
dc.titleEfficient Characterization of Interconnects With Arbitrary Polygonal Cross Sections Using Fokas-Derived Dirichlet-to-Neumann Operators
dc.typeJournal article
dc.contributor.imecauthorSun, Xiao
dc.contributor.imecauthorPantano, Nicolas
dc.contributor.imecauthorvan der Plas, Geert
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecSun, Xiao::0000-0002-2468-8933
dc.contributor.orcidimecPantano, Nicolas::0000-0002-8803-8374
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.identifier.doi10.1109/TCPMT.2023.3303101
dc.source.numberofpages9
dc.source.peerreviewyes
dc.source.beginpage1567
dc.source.endpage1575
dc.source.journalIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
dc.source.issue10
dc.source.volume13
imec.availabilityPublished - imec


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