dc.contributor.author | Bosman, Dries | |
dc.contributor.author | Huynen, Martijn | |
dc.contributor.author | De Zutter, Daniel | |
dc.contributor.author | Sun, Xiao | |
dc.contributor.author | Pantano, Nicolas | |
dc.contributor.author | van der Plas, Geert | |
dc.contributor.author | Beyne, Eric | |
dc.contributor.author | Ginste, Dries Vande | |
dc.contributor.author | Vande Ginste, Dries | |
dc.date.accessioned | 2024-03-04T13:34:04Z | |
dc.date.available | 2023-12-02T16:54:11Z | |
dc.date.available | 2024-03-04T13:34:04Z | |
dc.date.issued | 2023 | |
dc.identifier.issn | 2156-3950 | |
dc.identifier.other | WOS:001098139000005 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/43210.2 | |
dc.source | WOS | |
dc.title | Efficient Characterization of Interconnects With Arbitrary Polygonal Cross Sections Using Fokas-Derived Dirichlet-to-Neumann Operators | |
dc.type | Journal article | |
dc.contributor.imecauthor | Sun, Xiao | |
dc.contributor.imecauthor | Pantano, Nicolas | |
dc.contributor.imecauthor | van der Plas, Geert | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.orcidimec | Sun, Xiao::0000-0002-2468-8933 | |
dc.contributor.orcidimec | Pantano, Nicolas::0000-0002-8803-8374 | |
dc.contributor.orcidimec | Van der Plas, Geert::0000-0002-4975-6672 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.identifier.doi | 10.1109/TCPMT.2023.3303101 | |
dc.source.numberofpages | 9 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 1567 | |
dc.source.endpage | 1575 | |
dc.source.journal | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | |
dc.source.issue | 10 | |
dc.source.volume | 13 | |
imec.availability | Published - imec | |