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Wafer-level MEMS packaging

dc.contributor.authorParton, Els
dc.contributor.authorTilmans, Harrie
dc.date.accessioned2021-10-14T22:43:15Z
dc.date.available2021-10-14T22:43:15Z
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6699
dc.sourceIIOimport
dc.titleWafer-level MEMS packaging
dc.typeJournal article
dc.contributor.imecauthorParton, Els
dc.contributor.imecauthorTilmans, Harrie
dc.contributor.orcidimecTilmans, Harrie::0000-0003-4240-4962
dc.source.peerreviewno
dc.source.beginpage21
dc.source.endpage23
dc.source.journalAdvanced Packaging
dc.source.issue4
dc.source.volume11
imec.availabilityPublished - imec


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