Browsing by author "Zijl, Jurrian"
Now showing items 1-1 of 1
-
Low warpage wafer level transfer molding post 3D die to wafer assembly
Cadacio Jr., Francisco; Wang, Teng; Salahouelhadj, Abdellah; Capuz, Giovanni; Potoms, Goedele; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric; Gal, Wilfred; Zijl, Jurrian; Kersjes, Sebastiaan; Wensink, Henk (2016)