Browsing by author "Agarwal, Rahul"
Now showing items 1-11 of 11
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Cu/Sn microbumps interconnect for 3D TSV chip stacking
Agarwal, Rahul; Zhang, Wenqi; Limaye, Paresh; Labie, Riet; Dimcic, Biljana; Phommahaxay, Alain; Soussan, Philippe (2010) -
Design issues and cosiderations for low-cost 3D TSV IC technology
Van der Plas, Geert; Limaye, Paresh; Mercha, Abdelkarim; Oprins, Herman; Torregiani, Cristina; Thijs, Steven; Linten, Dimitri; Stucchi, Michele; Guruprasad, Katti; Velenis, Dimitrios; Shinichi, Domae; Cherman, Vladimir; Vandevelde, Bart; Simons, Veerle; De Wolf, Ingrid; Labie, Riet; Perry, Dan; Bronckers, Stephane; Minas, Nikolaos; Cupak, Miroslav; Ruythooren, Wouter; Van Olmen, Jan; Phommahaxay, Alain; de Potter de ten Broeck, Muriel; Opdebeeck, Ann; Rakowski, Michal; De Wachter, Bart; Dehan, Morin; Nelis, Marc; Agarwal, Rahul; Dehaene, Wim; Travaly, Youssef; Marchal, Pol; Beyne, Eric (2010) -
Diamond bit cutting for processing high topography wafers
Agarwal, Rahul; Pham, Nga; Cotrin Teixeira, Ricardo; Andrei, Alexandru; Ruythooren, Wouter; Iker, Francois; Soussan, Philippe (2009) -
Die stacking using 3D-wafer level packaging copper/polymer through-Si via technology and Cu/Sn interconnect bumping
Civale, Yann; Sabuncuoglu Tezcan, Deniz; Philipsen, Harold; Jaenen, Patrick; Agarwal, Rahul; Duval, Fabrice; Soussan, Philippe; Travaly, Youssef; Beyne, Eric (2009) -
Enabling 10μm pitch hybrid Cu-Cu IC stacking with Through Silicon Vias
Huyghebaert, Cedric; Van Olmen, Jan; Okoro, Chukwudi; Coenen, Jens; Jourdain, Anne; Van Cauwenberghe, Marc; Agarwal, Rahul; Phommahaxay, Alain; Stucchi, Michele; Soussan, Philippe (2010) -
High density Cu-Sn TLP bonding for 3D integration
Agarwal, Rahul; Zhang, Wenqi; Limaye, Paresh; Ruythooren, Wouter (2009) -
Insertion bonding: A novel Cu-Cu bonding approach for 3D integration
Okoro, Chukwudi; Agarwal, Rahul; Limaye, Paresh; Vandevelde, Bart; Vandepitte, Dirk; Beyne, Eric (2010) -
Low temperature direct Cu-Cu immersion bonding for 3D integration
Agarwal, Rahul; Ruythooren, Wouter (2009) -
Novel Cu-Cu bonding technique: the insertion bonding approach
Okoro, Chukwudi; Limaye, Paresh; Agarwal, Rahul; Vandevelde, Bart; Beyne, Eric; Vandepitte, Dirk (2011) -
Surface planarization of Cu/Sn micro-bump and its application in fine pitch Cu/Sn solid state diffusion bonding
Zhang, Wenqi; Limaye, Paresh; Agarwal, Rahul; Soussan, Philippe (2010) -
Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack – challenges and solutions
Van der Plas, Geert; Thijs, Steven; Linten, Dimitri; Katti, Guruprasad; Limaye, Paresh; Mercha, Abdelkarim; Stucchi, Michele; Oprins, Herman; Vandevelde, Bart; Minas, Nikolaos; Cupak, Miroslav; Dehan, Morin; Nelis, Marc; Agarwal, Rahul; Dehaene, Wim; Travaly, Youssef; Beyne, Eric; Marchal, Pol (2010-09)