Authors

Civale, Yann; Sabuncuoglu Tezcan, Deniz; Philipsen, Harold; Jaenen, Patrick; Agarwal, Rahul; Duval, Fabrice; Soussan, Philippe; Travaly, Youssef; Beyne, Eric

Conference

IEEE International Conference on 3D System Integration

Title

Die stacking using 3D-wafer level packaging copper/polymer through-Si via technology and Cu/Sn interconnect bumping

Publication type

Proceedings paper

Embargo date

9999-12-31