Browsing by author "Hatakeyama, Keiichi"
Now showing items 1-2 of 2
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3D IC assembly using thermal compression bonding and wafer-level underfill – strategies for quality improvement and throughput enhancement
Wang, Teng; Bex, Pieter; Capuz, Giovanni; Duval, Fabrice; Inoue, Fumihiro; Gerets, Carine; Bertheau, Julien; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric; Natsukawa, Masanori; Mitsukura, Kazuyuki; Hatakeyama, Keiichi (2016) -
Development and evaluation of photodefinable wafer level underfill
Mitsukura, Kazuyuki; Saisyo, Ryouta; Makino, Tatsuya; Hatakeyama, Keiichi; Minegishi, Tomonori; Wang, Teng; Daily, Robert; Duval, Fabrice; Rebibis, Kenneth June; Miller, Andy; Beyne, Eric (2015)