Authors

Wang, Teng; Bex, Pieter; Capuz, Giovanni; Duval, Fabrice; Inoue, Fumihiro; Gerets, Carine; Bertheau, Julien; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric; Natsukawa, Masanori; Mitsukura, Kazuyuki; Hatakeyama, Keiichi

Conference

IEEE 18th Electronic Packaging Technology Conference - EPTC

Title

3D IC assembly using thermal compression bonding and wafer-level underfill – strategies for quality improvement and throughput enhancement

Publication type

Proceedings paper

Embargo date

9999-12-31