Publication:

3D IC assembly using thermal compression bonding and wafer-level underfill – strategies for quality improvement and throughput enhancement

Date

2016
Proceedings Paper
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dc.contributor.authorWang, Teng
dc.contributor.authorBex, Pieter
dc.contributor.authorCapuz, Giovanni
dc.contributor.authorDuval, Fabrice
dc.contributor.authorInoue, Fumihiro
dc.contributor.authorGerets, Carine
dc.contributor.authorBertheau, Julien
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.authorNatsukawa, Masanori
dc.contributor.authorMitsukura, Kazuyuki
dc.contributor.authorHatakeyama, Keiichi
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorCapuz, Giovanni
dc.contributor.imecauthorDuval, Fabrice
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorBertheau, Julien
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecCapuz, Giovanni::0000-0002-5263-4836
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecMiller, Andy::0000-0001-7048-2242
dc.date.accessioned2021-10-23T17:04:05Z
dc.date.available2021-10-23T17:04:05Z
dc.date.embargo9999-12-31
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27574
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7861589/
dc.source.beginpage791
dc.source.conferenceIEEE 18th Electronic Packaging Technology Conference - EPTC
dc.source.conferencedate30/11/2016
dc.source.conferencelocationSingapore Singapore
dc.source.endpage796
dc.title

3D IC assembly using thermal compression bonding and wafer-level underfill – strategies for quality improvement and throughput enhancement

dc.typeProceedings paper
dspace.entity.typePublication
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