Browsing by author "Tekin, T."
Now showing items 1-4 of 4
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3D silicon photonics interposer for Tb/s optical interconnects in data centers with double-side assembled active components and integrated optical and electrical through silicon via on SOI
Sirbu, B.; Eichhammer, Y.; Oppermann, H.; Tekin, T.; Kraft, J.; Sidorov, V.; Yin, Xin; Bauwelinck, Johan; Neumeyr, C.; Soares, F. (2019) -
CMOS compatible silicon etched V-grooves integrated with a SOI fiber coupling technique for enhancing fiber-to-chip alignment
Galan, V.J.; Sanchis, P.; Marti, J.; Marx, S.; Schröder, H.; Murhopadhyay, B.; Tekin, T.; Selvaraja, Shankar; Bogaerts, Wim; Dumon, Pieter; Zimmerman, L. (2009) -
ePIXpack - advanced smart packaging solutions for silicon photonics
Zimmerman, L.; Schroder, H.; Dumon, Pieter; Bogaerts, Wim; Tekin, T. (2008-06) -
g-Pack - a generic testbed package for silicon photonics devices
Zimmermann, L.; Schroder, H.; Tekin, T.; Dumon, Pieter; Bogaerts, Wim (2008-09)