Authors
Sirbu, B.;
Eichhammer, Y.;
Oppermann, H.;
Tekin, T.;
Kraft, J.;
Sidorov, V.;
Yin, Xin;
Bauwelinck, Johan;
Neumeyr, C.;
Soares, F.
Conference
IEEE 69th Electronic Components and Technology Conference - ECTC
Title
3D silicon photonics interposer for Tb/s optical interconnects in data centers with double-side assembled active components and integrated optical and electrical through silicon via on SOI
Publication type
Proceedings paper
Embargo date
9999-12-31
