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3D silicon photonics interposer for Tb/s optical interconnects in data centers with double-side assembled active components and integrated optical and electrical through silicon via on SOI

Date

2019
Proceedings Paper
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dc.contributor.authorSirbu, B.
dc.contributor.authorEichhammer, Y.
dc.contributor.authorOppermann, H.
dc.contributor.authorTekin, T.
dc.contributor.authorKraft, J.
dc.contributor.authorSidorov, V.
dc.contributor.authorYin, Xin
dc.contributor.authorBauwelinck, Johan
dc.contributor.authorNeumeyr, C.
dc.contributor.authorSoares, F.
dc.contributor.imecauthorYin, Xin
dc.contributor.imecauthorBauwelinck, Johan
dc.contributor.orcidimecYin, Xin::0000-0002-9672-6652
dc.contributor.orcidimecBauwelinck, Johan::0000-0001-5254-2408
dc.date.accessioned2021-10-27T18:29:37Z
dc.date.available2021-10-27T18:29:37Z
dc.date.embargo9999-12-31
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/34020
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8811251
dc.source.beginpage1052
dc.source.conferenceIEEE 69th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate25/05/2019
dc.source.conferencelocationLas Vegas USA
dc.source.endpage1059
dc.title

3D silicon photonics interposer for Tb/s optical interconnects in data centers with double-side assembled active components and integrated optical and electrical through silicon via on SOI

dc.typeProceedings paper
dspace.entity.typePublication
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