Browsing by author "Ramm, P."
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3D integration technology: status and application development
Ramm, P.; Klumpp, A.; Weber, Josef; Lietaer, N.; Taklo, Maaike; De Raedt, Walter; Fritzsch, T.; Couderc, Pascal (2010) -
3D TSV based high frequency components for RF IC and RF MEMS applications
Fernandez-Bolanos, Montserrat; Vitale, Wolfgang; Maqueda Lopez, Mariazel; Ionescu, Adrian M.; Ocket, Ilja; De Raedt, Walter; Klumpp, Armin; Merkel, R.; Weber, J.; Ramm, P.; Enayati, Amin (2016)