Browsing by author "Klumpp, Armin"
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3D TSV based high frequency components for RF IC and RF MEMS applications
Fernandez-Bolanos, Montserrat; Vitale, Wolfgang; Maqueda Lopez, Mariazel; Ionescu, Adrian M.; Ocket, Ilja; De Raedt, Walter; Klumpp, Armin; Merkel, R.; Weber, J.; Ramm, P.; Enayati, Amin (2016) -
Very small pitch micro bump array probing
Boehm, Gunther; Kalt, Samuel; Kiesewetter, Joerg; Klumpp, Armin; Marinissen, Erik Jan; Schaefer, Wolfgang (2013)