Browsing by author "Nguyen, Ha-Ai"
Now showing items 1-3 of 3
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Microbump lithography for 3D stacking applications
Jaenen, Patrick; Slabbekoorn, John; Miller, Andy; Flack, Warren W.; Ranjan, Manish; Kenyon, Gareth; Hsieh, Robert; Nguyen, Ha-Ai (2013) -
One micron damascene redistribution for fan-out wafer level packaging using a photosensitive dielectric material
Flack, Warren; Hsieh, Robert; Nguyen, Ha-Ai; Slabbekoorn, John; Suhard, Samuel; Miller, Andy; Hiro, Akito; Hidremont, Romain (2018) -
One micron redistribution for fan-out wafer level packaging
Flack, Warren; Hsieh, Robert; Nguyen, Ha-Ai; Slabbekoorn, John; Lorant, Christophe; Miller, Andy (2017)