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One micron redistribution for fan-out wafer level packaging
Publication:
One micron redistribution for fan-out wafer level packaging
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Date
2017
Proceedings Paper
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37382.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Flack, Warren
;
Hsieh, Robert
;
Nguyen, Ha-Ai
;
Slabbekoorn, John
;
Lorant, Christophe
;
Miller, Andy
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Views
1877
since deposited on 2021-10-24
1
last month
1
last week
Acq. date: 2026-01-10
Citations