One micron redistribution for fan-out wafer level packaging

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Authors
Flack, Warren; Hsieh, Robert; Nguyen, Ha-Ai; Slabbekoorn, John; Lorant, Christophe; Miller, Andy
Conference
IEEE 19th Electronics Packaging Technology Conference - EPTC
Title
One micron redistribution for fan-out wafer level packaging
Publication type
Proceedings paper
Embargo date
9999-12-31
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