Browsing by author "Gardner, G."
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Integration of low stress photopatternable silicones into a wafer level package
Gardner, G.; Harkness, B.; Ohare, E.; Meynen, H.; Vanden Bulcke, Mathieu; Gonzalez, Mario; Beyne, Eric (2004-06) -
Introducing a silicone under the bump configuration for stress relief in a wafer level package
Vanden Bulcke, Mathieu; Gonzalez, Mario; Vandevelde, Bart; Winters, Christophe; Beyne, Eric; Larson, L.; Harkness, B.R.; Gardner, G.; Mohamed, M.; Sudbury-Holtschlag, J.; Meynen, H. (2003)