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Introducing a silicone under the bump configuration for stress relief in a wafer level package
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Authors
Vanden Bulcke, Mathieu
;
Gonzalez, Mario
;
Vandevelde, Bart
;
Winters, Christophe
;
Beyne, Eric
;
Larson, L.
;
Harkness, B.R.
;
Gardner, G.
;
Mohamed, M.
;
Sudbury-Holtschlag, J.
;
Meynen, H.
Conference
Proceedings EPTC - Electronics Packaging Technology Conference
Title
Introducing a silicone under the bump configuration for stress relief in a wafer level package
Publication type
Proceedings paper
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