Publication:

Introducing a silicone under the bump configuration for stress relief in a wafer level package

Date

2003
Proceedings Paper
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dc.contributor.authorVanden Bulcke, Mathieu
dc.contributor.authorGonzalez, Mario
dc.contributor.authorVandevelde, Bart
dc.contributor.authorWinters, Christophe
dc.contributor.authorBeyne, Eric
dc.contributor.authorLarson, L.
dc.contributor.authorHarkness, B.R.
dc.contributor.authorGardner, G.
dc.contributor.authorMohamed, M.
dc.contributor.authorSudbury-Holtschlag, J.
dc.contributor.authorMeynen, H.
dc.contributor.imecauthorVanden Bulcke, Mathieu
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorWinters, Christophe
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-15T07:23:44Z
dc.date.available2021-10-15T07:23:44Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8311
dc.source.beginpage380
dc.source.conferenceProceedings EPTC - Electronics Packaging Technology Conference
dc.source.conferencedate11/12/2003
dc.source.conferencelocationSingapore
dc.source.endpage384
dc.title

Introducing a silicone under the bump configuration for stress relief in a wafer level package

dc.typeProceedings paper
dspace.entity.typePublication
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