Publication:

Introducing a silicone under the bump configuration for stress relief in a wafer level package

Date

2003

Proceedings Paper

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Author(s)

Vanden Bulcke, Mathieu

;

Gonzalez, Mario

;

Vandevelde, Bart

;

Winters, Christophe

;

;

;

;

;

;

Sudbury-Holtschlag, J.

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Statistics

1995 since deposited on 2021-10-15

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Acq. date: 2026-02-24