Browsing by author "Eichorst, Michael"
Now showing items 1-1 of 1
-
Strain Measurements and Thermo-Mechanical Simulation of SnAgCu vs. low melting point alloy (LMPA-Q) solder joints
Vandevelde, Bart; Labie, Riet; Lauwaert, Ralph; Dudek, Rainer; Gromala, Przemyslaw; Eichorst, Michael (2023)