Authors

Vandevelde, Bart; Labie, Riet; Lauwaert, Ralph; Dudek, Rainer; Gromala, Przemyslaw; Eichorst, Michael

DOI

10.1109/EuroSimE56861.2023.10100841

EISBN

979-8-3503-4597-1

ISSN

2833-8553

Conference

24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Journal

na

Title

Strain Measurements and Thermo-Mechanical Simulation of SnAgCu vs. low melting point alloy (LMPA-Q) solder joints

Publication type

Proceedings paper