| dc.contributor.author | Vandevelde, Bart | |
| dc.contributor.author | Labie, Riet | |
| dc.contributor.author | Lauwaert, Ralph | |
| dc.contributor.author | Dudek, Rainer | |
| dc.contributor.author | Gromala, Przemyslaw | |
| dc.contributor.author | Eichorst, Michael | |
| dc.date.accessioned | 2023-11-23T08:51:45Z | |
| dc.date.available | 2023-10-15T17:21:19Z | |
| dc.date.available | 2023-11-23T08:51:45Z | |
| dc.date.issued | 2023 | |
| dc.identifier.issn | 2833-8553 | |
| dc.identifier.other | WOS:001058887300096 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/42756.2 | |
| dc.source | WOS | |
| dc.title | Strain Measurements and Thermo-Mechanical Simulation of SnAgCu vs. low melting point alloy (LMPA-Q) solder joints | |
| dc.type | Proceedings paper | |
| dc.contributor.imecauthor | Vandevelde, Bart | |
| dc.contributor.imecauthor | Labie, Riet | |
| dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
| dc.contributor.orcidimec | Labie, Riet::0000-0002-1401-1291 | |
| dc.identifier.doi | 10.1109/EuroSimE56861.2023.10100841 | |
| dc.identifier.eisbn | 979-8-3503-4597-1 | |
| dc.source.numberofpages | 8 | |
| dc.source.peerreview | yes | |
| dc.source.conference | 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) | |
| dc.source.conferencedate | APR 16-19, 2023 | |
| dc.source.conferencelocation | Graz | |
| dc.source.journal | na | |
| imec.availability | Published - imec | |
| dc.description.wosFundingText | This research is part of the European R&D&I EUREKA-PENTA project "HiPer" (High Performance Vehicle Computer and Communication System for Autonomous Driving), supported by industry association AENEAS and aiming to build on Europe's leading position in automotive AD for the future of road mobility. We would like to thank VLAIO, BMBF and PENTA for partially funding the HiPer project. | |
