Browsing by author "Lauwaert, Ralph"
Now showing items 1-10 of 10
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Board-level solder intermetallic strength measurements using mini-Charpy shock testing and FEM calibration
Labie, Riet; Duflos, Frederic; Vandevelde, Bart; Allaert, Bart; Lauwaert, Ralph; Willems, Geert (2018) -
Effect of a ductile, low melting point alloy on the hot tear defect on lead-free ball grid arrays
Teliszewski, Steven; Lauwaert, Ralph; Vandevelde, Bart (2020) -
ENHANCED PROCESSABILITY AND THERMAL FATIGUE RELIABILITY WITH LOW MELTING POINT SNBI SOLDER ALLOY LMPA-Q
Vandevelde, Bart; Nawghane, Chinmay; Labie, Riet; Lauwaert, Ralph; Werkhoven, Daniel (2021) -
Four-point bending cycling as alternative for thermal cycling solder fatigue testing
Vandevelde, Bart; Vanhee, Filip; Pissoort, Davy; Degrendele, Lieven; De Baets, Johan; Allaert, Bart; Lauwaert, Ralph; Labie, Riet; Willems, Geert (2016-04) -
Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components
Vandevelde, Bart; Vanhee, Filip; Pissoort, Davy; Degrendele, Lieven; De Baets, Johan; Allaert, Bart; Lauwaert, Ralph; Zanon, Franco; Labie, Riet; Willems, Geert (2017) -
How the mold compound thermal expansion overrules the solder composition choice in board level reliability performance
Vandevelde, Bart; Degrendele, Lieven; Cauwe, Maarten; Allaert, Bart; Lauwaert, Ralph; Willems, Geert (2016-04) -
Impact of pad finish on mechanical shock resistance of lead-free solder joints tested under shear and in pull mode
Vandevelde, Bart; Van Kerckhove, Matthias; Degryse, Dominiek; D'Haese, Wim; Schaubroeck, David; Allaert, Bart; Geerinckx, Eddy; Lauwaert, Ralph; Willems, Geert (2013) -
Improved QFN thermal cycling reliability using low melting temperature SnBi based solder paste LMPA-Q
Vandevelde, Bart; Labie, Riet; Lauwaert, Ralph; Werkhoven, Daniel; Vanderstraeten, Daniel; Blansaer, Eddy; Lannoo, Jonas; Pissoort, Davy (2019) -
Investigation of solder joint deformation under thermo-mechanical loading using DIC techniques
Eichhorst, Michael; Seiler, B.; Scheiter, L.; Vandevelde, Bart; Lauwaert, Ralph (2020) -
Strain Measurements and Thermo-Mechanical Simulation of SnAgCu vs. low melting point alloy (LMPA-Q) solder joints
Vandevelde, Bart; Labie, Riet; Lauwaert, Ralph; Dudek, Rainer; Gromala, Przemyslaw; Eichorst, Michael (2023)