EISBN
978-0-7918-8550-5
ISSN
na
Conference
ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)
Journal
na
Title
ENHANCED PROCESSABILITY AND THERMAL FATIGUE RELIABILITY WITH LOW MELTING POINT SNBI SOLDER ALLOY LMPA-Q
Publication type
Proceedings paper