Browsing by author "Werkhoven, Daniel"
Now showing items 1-4 of 4
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A study of brittle to ductile fracture transition temperatures in bulk Pb-free solders
Ratchev, Petar; Loccufier, Tony; Vandevelde, Bart; Verlinden, Bert; Teliszewski, Steven; Werkhoven, Daniel; Allaert, Bart (2005) -
ENHANCED PROCESSABILITY AND THERMAL FATIGUE RELIABILITY WITH LOW MELTING POINT SNBI SOLDER ALLOY LMPA-Q
Vandevelde, Bart; Nawghane, Chinmay; Labie, Riet; Lauwaert, Ralph; Werkhoven, Daniel (2021) -
Improved QFN thermal cycling reliability using low melting temperature SnBi based solder paste LMPA-Q
Vandevelde, Bart; Labie, Riet; Lauwaert, Ralph; Werkhoven, Daniel; Vanderstraeten, Daniel; Blansaer, Eddy; Lannoo, Jonas; Pissoort, Davy (2019) -
In-situ monitoring of field conditions and interconnect integrity for an electronic on-board module
Labie, Riet; Vandevelde, Bart; Van Meensel, Wesley; Vogeleer, Mike; Werkhoven, Daniel; Allaert, Bart; Willems, Geert (2017)