Authors

Vandevelde, Bart; Labie, Riet; Lauwaert, Ralph; Werkhoven, Daniel; Vanderstraeten, Daniel; Blansaer, Eddy; Lannoo, Jonas; Pissoort, Davy

Conference

20th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

Title

Improved QFN thermal cycling reliability using low melting temperature SnBi based solder paste LMPA-Q

Publication type

Proceedings paper

Embargo date

9999-12-31