Publication:

Improved QFN thermal cycling reliability using low melting temperature SnBi based solder paste LMPA-Q

Date

2019
Proceedings Paper
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dc.contributor.authorVandevelde, Bart
dc.contributor.authorLabie, Riet
dc.contributor.authorLauwaert, Ralph
dc.contributor.authorWerkhoven, Daniel
dc.contributor.authorVanderstraeten, Daniel
dc.contributor.authorBlansaer, Eddy
dc.contributor.authorLannoo, Jonas
dc.contributor.authorPissoort, Davy
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorLabie, Riet
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.date.accessioned2021-10-27T21:46:09Z
dc.date.available2021-10-27T21:46:09Z
dc.date.embargo9999-12-31
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/34304
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8724511
dc.source.beginpage1
dc.source.conference20th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
dc.source.conferencedate24/03/2019
dc.source.conferencelocationHannover Germany
dc.source.endpage5
dc.title

Improved QFN thermal cycling reliability using low melting temperature SnBi based solder paste LMPA-Q

dc.typeProceedings paper
dspace.entity.typePublication
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