Browsing by author "Nawghane, Chinmay"
Now showing items 1-11 of 11
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A Hybrid Model for Prognostic and Health Management of Electronic Devices
Murgia, Alessandro; Harsha, Chaitra; Tsiporkova, Elena; Nawghane, Chinmay; Vandevelde, Bart (2024) -
A PoF based methodology to assess the reliability of a sensor module operating in harsh industrial environments
Nawghane, Chinmay; Vandevelde, Bart; Labie, Riet; Michiels, Sam; Hughes, Danny; Liu, Mengyao (2022-04-20) -
Artificial Neural Network Regressor for Parametric Solder Strain Models for BGAs
Ferrando Villalba, Pablo; Nawghane, Chinmay; Vandevelde, Bart (2020) -
Challenges in introducing high-density interconnect technology in printed circuit boards for space applications
Cauwe, Maarten; Vandevelde, Bart; Nawghane, Chinmay; Van de Slyeke, Marnix; Coulon, Alexia; Heltzel, Stan (2023) -
Deformation analysis of QFN packages for validation of thermo-mechanical finite element simulations
Nawghane, Chinmay; Moncond'huy, Thomas; Vandevelde, Bart; Vernhes, Pierre; Cruz, Rodolfo (2023) -
ENHANCED PROCESSABILITY AND THERMAL FATIGUE RELIABILITY WITH LOW MELTING POINT SNBI SOLDER ALLOY LMPA-Q
Vandevelde, Bart; Nawghane, Chinmay; Labie, Riet; Lauwaert, Ralph; Werkhoven, Daniel (2021) -
Exchanging Thermo-Mechanical Simulation Models independent on FEM Software Platform
Vandevelde, Bart; Nawghane, Chinmay; Dudek, Rainer; Doering, Ralf; Schindele, Jens; Gromala, Przemyslaw (2022) -
High-density interconnect technology assessment of printed circuit boards for space applications
Cauwe, Maarten; Vandevelde, Bart; Nawghane, Chinmay; Van De Slyeke, Marnix; Bosman, Erwin; Verhegge, Joachim; Coulon, Alexia; Heltzel, Stan (2020) -
Molecular detection of SARS-COV-2 in exhaled breath at the point-of-need
Stakenborg, Tim; Raymenants, Joren; Taher, Ahmed; Marchal, Elisabeth; Verbruggen, Bert; Roth, Sophie; Jones, Ben; Yurt, Abdulkadir; Duthoo, Wout; Bombeke, Klaas; Fauvart, Maarten; Verplanken, Julien; Wiederkehr, Rodrigo Sergio; Humbert, Aurelie; Dang Thi Thuy, Chi; Vlassaks, Evi; Jauregui Uribe, Alejandra; Luo, Zhenxiang; Liu, Chengxun; Zinoviev, Kirill; Labie, Riet; Darriba Frederiks, Aduen; Saldien, Jelle; Covens, Kris; Berden, Pieter; Schreurs, Bert; Van Duppen, Joost; Hanifa, Rabea; Beuscart, Megane; Pham, Van; Emmen, Erik; Dewagtere, Annelien; Lin, Ziduo; Peca, Marco; El Jerrari, Youssef; Nawghane, Chinmay; Arnett, Chad; Lambrechts, Andy; Deshpande, Paru; Lagrou, Katrien; De Munter, Paul; Andre, Emmanuel; Van den Wijngaert, Nik; Peumans, Peter (2022) -
Thermal cycling life testing of Plated Through Hole vias in PCBs
Nawghane, Chinmay; Vandevelde, Bart; Cauwe, Maarten (2019) -
Vibration fatigue analysis of lead-free CSP assemblies on printed circuit board
Nawghane, Chinmay; Vandevelde, Bart; Labie, Riet; Allaert, Bart; Lauwaert, Ralf; Vanhee, Filip; Pissoort, Davy; De Wolf, Ingrid; Mehner, Jan (2018-04)