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Challenges in introducing high-density interconnect technology in printed circuit boards for space applications
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Authors
Cauwe, Maarten
;
Vandevelde, Bart
;
Nawghane, Chinmay
;
Van de Slyeke, Marnix
;
Coulon, Alexia
;
Heltzel, Stan
DOI
10.1007/s12567-021-00403-2
ISSN
1868-2502
Issue
1
Journal
CEAS SPACE JOURNAL
Volume
15
Title
Challenges in introducing high-density interconnect technology in printed circuit boards for space applications
Publication type
Journal article
Embargo date
2023-07-31
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2
20.500.12860/41960.2
*
2023-08-02T09:18:56Z
validation by library/open access desk
1
20.500.12860/41960
2023-06-20T10:36:49Z
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