Browsing by author "Heltzel, Stan"
Now showing items 1-3 of 3
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Advanced PCB technologies for space and their assessment using up-to-date standards
Heltzel, Stan; Cauwe, Maarten; Bennett, Joe; Rohr, Thomas (2023) -
Challenges in introducing high-density interconnect technology in printed circuit boards for space applications
Cauwe, Maarten; Vandevelde, Bart; Nawghane, Chinmay; Van de Slyeke, Marnix; Coulon, Alexia; Heltzel, Stan (2023) -
High-density interconnect technology assessment of printed circuit boards for space applications
Cauwe, Maarten; Vandevelde, Bart; Nawghane, Chinmay; Van De Slyeke, Marnix; Bosman, Erwin; Verhegge, Joachim; Coulon, Alexia; Heltzel, Stan (2020)