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High-density interconnect technology assessment of printed circuit boards for space applications
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Authors
Cauwe, Maarten
;
Vandevelde, Bart
;
Nawghane, Chinmay
;
Van De Slyeke, Marnix
;
Bosman, Erwin
;
Verhegge, Joachim
;
Coulon, Alexia
;
Heltzel, Stan
ISSN
1551-4897
Issue
3
Journal
Journal of Microelectronics and Electronic Packaging
Volume
17
Title
High-density interconnect technology assessment of printed circuit boards for space applications
Publication type
Journal article
Embargo date
9999-12-31
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