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Articles
High-density interconnect technology assessment of printed circuit boards for space applications
Publication:
High-density interconnect technology assessment of printed circuit boards for space applications
Date
2020
Journal article
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47069.pdf
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Cauwe, Maarten
;
Vandevelde, Bart
;
Nawghane, Chinmay
;
Van De Slyeke, Marnix
;
Bosman, Erwin
;
Verhegge, Joachim
;
Coulon, Alexia
;
Heltzel, Stan
Journal
Journal of Microelectronics and Electronic Packaging
Abstract
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2029
since deposited on 2021-10-28
Acq. date: 2025-10-28
Citations
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Views
2029
since deposited on 2021-10-28
Acq. date: 2025-10-28
Citations