High-density interconnect technology assessment of printed circuit boards for space applications

dc.contributor.author	Cauwe, Maarten
dc.contributor.author	Vandevelde, Bart
dc.contributor.author	Nawghane, Chinmay
dc.contributor.author	Van De Slyeke, Marnix
dc.contributor.author	Bosman, Erwin
dc.contributor.author	Verhegge, Joachim
dc.contributor.author	Coulon, Alexia
dc.contributor.author	Heltzel, Stan
dc.contributor.imecauthor	Cauwe, Maarten
dc.contributor.imecauthor	Vandevelde, Bart
dc.contributor.imecauthor	Nawghane, Chinmay
dc.contributor.orcidimec	Cauwe, Maarten::0000-0002-6413-998X
dc.contributor.orcidimec	Vandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimec	Nawghane, Chinmay::0000-0002-1867-827X
dc.date.accessioned	2021-10-28T20:37:25Z
dc.date.available	2021-10-28T20:37:25Z
dc.date.embargo	9999-12-31
dc.date.issued	2020
dc.identifier.issn	1551-4897
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/34870
dc.identifier.url	https://doi.org/10.4071/imaps.1212898
dc.source.beginpage	79
dc.source.endpage	88
dc.source.issue	3
dc.source.journal	Journal of Microelectronics and Electronic Packaging
dc.source.volume	17
dc.title	High-density interconnect technology assessment of printed circuit boards for space applications
dc.type	Journal article
dspace.entity.type	Publication
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